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Southco Launches Next-Gen Liquid Cooling Access Solutions at COMPUTEX 2026
Selasa, 02 Juni 2026 | 20:03
HONG KONG SAR -
Media OutReach Newswire
- 2 June 2026 - Southco Asia Ltd., a subsidiary of Southco Inc., the
global leader in engineered access solutions, is pleased to announce its
participation in COMPUTEX 2026, taking place June 2–5 in Taipei. As one
of the world's most influential technology exhibitions, COMPUTEX brings
together industry leaders, engineers and partners, offering a key
platform for Southco to unveil its latest technologies and engage with
the Hyperscale datacenter, server, networking and liquid cooling
community.
Just in time for COMPUTEX Southco will debut its brand-new Blind Mate
Quick Disconnect Adapter and Inject Eject Mechanism, a purpose-built
hardware solution engineered exclusively for liquid-cooled servers and
high-density data center environments. The adapter's design directly
addresses critical customer pain points including difficult blind
alignment, risky dry-break connections, and high insertion forces that
complicate installation and maintenance. The new solution integrates
refined structural performance to address high density computing
challenges.
The adapter delivers exceptional misalignment tolerance, enabling
reliable, effortless connection and disconnection for server and rack
integration. Integrated within the solution, the matched dual-pivot
ejector reduces operating force and features a foldable handle for easy
front access. Working in synergy, an ergonomic injection and ejection
force allows the ejectors to enable precise physical strength to
activate and secure connection of blind mate adapter for consistent,
leak-proof fluid connectivity.
"Keeping pace with global client demands and industry progression
remains our enduring priority," Jason Cheng, business development
director at Southco, says. "We proudly showcase our innovations
engineered to solve liquid cooling challenges. Field-proven at top-tier
client projects, Southco's solutions deliver enhanced efficiency and
reliability for AI and high-performance computing applications."
BERITA LAINNYA
BERIKAN KOMENTAR